Will BGA short circuit be caused by offset of solder mask printing of circuit board?
PCB problem Can BGA short circuit be caused by printing offset of solder mask of circuit board?
鑫景福致力于滿足“快速服務，零缺陷，輔助研發”PCBA訂購單需求。
新聞中心
PCB process COB_ Process introduction_ Precautions_ Part II
PCB manufacturers and PCB designers explain COB to you_ Process introduction
PCB Process COB Process Introduction_ Precautions_ Part I
PCB manufacturers and PCB designers explain COB manufacturing process
Precautions for PTF printing on PET
The circuit board manufacturer and circuit board designer explain the precautions for PTF printing o...
Pcb process: precautions for using metal reed as rubber key
The circuit board manufacturer and circuit board designer will explain the precautions for metal ree...
How to evaluate a SMT foundry for PCB process
Circuit board manufacturers and circuit board designers explain how to evaluate a SMT foundry
PCB process circuit board assembly function test (FVT)
The circuit board manufacturer and circuit board designer will explain the functional test of circui...
Discussion on the sinkage of PCB to PCB connector spring
Discussion on the sinkage of PCB process board to board connector spring
Solution to prevent the first part from falling during secondary back welding
Circuit board manufacturer: the solution to prevent the first part from falling down during secondar...
SMD parts changed to through hole solder paste
What are the differences and effects of the process of changing SMD parts into Paste In Hole solder ...
Increase the amount of solder paste to improve BGA welding defects?
PCB manufacturers and PCB designers explain that increasing solder paste can improve BGA welding def...
Solder paste selection for PCB process
PCB manufacturers and PCB designers explain how to select solder pastes
抖音二維碼
Q Q二維碼
微信二維碼
點擊
然后
聯系
然后
聯系
電話熱線
13410863085Q Q
微信
- 郵箱