Production and processing of high frequency PCB
Definition of high frequency board is used for circuit board production<1 href="/tw/high frequency PCB. html" target="_self" textvalue="printed circuit board high frequency board">printed circuit board high frequency board refers to a special circuit board with high electromagnetIC frequency, which is used in the fields of high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter) Generally speaking, a high-frequency board can be defined as a circuit board with a frequency higher than 1GHz!
High frequency PCB

With the rapid development of science and technology, more and more equipment designs are applied in the microwave frequency band (>1GHZ) or even in the millimeter wave field (30GHZ) This also means that the frequency is getting higher and higher For example, the substrate data needs to have good power efficiency and chEMIcal stability. With the increase of power signal frequency, the loss on the substrate is very SMAll, so the high-frequency plate is highlighted 2. Application field of printed circuit board high-frequency board: mobile communication products; Power amplifier, low noise amplifier, etc; Passive components such as power divider, coupler, duplexer, screening program, etc; Vehicle anti-collision system, satellite system, radio system, and other fields, high-frequency electronic equipment are the development trend
2. Application field of printed circuit board high-frequency board: mobile communication products; Power amplifier, low noise amplifier, etc; Passive components such as power divider, coupler, duplexer, screening program, etc; Vehicle anti-collision system, satellite system, radio system, and other fields, high-frequency electronic equipment are the development trend
Classification of high frequency board powder ceramic filLED thermo setting material
A. Manufacturer:
4350B/4003C from Rogers
Arlon's 25N/25FR
Taconic's TLG series
B. circuit board processing method:
The processing process is SIMilar to epoxy resin/class woven cloth (FR4) When drilling and striking gongs, the life of drill bits and bow knives is reduced by 20% PTFE (polytetrafluoroethylene) material
A. Manufacturer: RO3000 series, RT series, TMM series from Rogers
Arlon's AD/AR series, IsoClad series, CuClad series
Taconic's RF series, TLX series, TLY series
Taixing Microwave's F4B, F4BM, F4BK, TP-2
B. Cutting: The protective film must be kept for cutting to prevent scratches and creating
2. Drilling
1. Use a brand new drill tip (standard 130), the pressure of the press foot is 40psi
2. Aluminum plate is a cover plate, and then the PTFE plate is fastened with a 1mm metal backing plate
3. Use an air gun to blow out the dust in the hole
4. Use the most stable drilling rig and drilling parameters (basically the smaller the hole, the smaller the return speed)
3. Hole treatment
Plasma treatment or sodium naphthalene activation treatment is conducive to hole metallization
4.PTH copper sink
1 After the micro etching rate has been controlled by 20 microinches, the PTH pulls from the de oiler cyclinder to enter the board
2 If necessary, just start the board from the expected cyclinder through the second PTH
5. Solder mask
1 Pre-treatment: Use acidic plate washing instead of mechanical grinding plate
2 Baking plate after pretreatment (90 degree Celsius, 30min), brush with green oil to cure
3 Baking plates in three stages: one section of 80 degree Celsius, 100 ℃, 150 ℃, each for 30 minutes (if you find that the abstract surface is oil, you can rework: wash off the green oil and activate it)
6.Gong board
Lay the white paper on the circuit surface of the PTFE board and clamp it up and down with FR-4 substrate or phenolic substrate with thickness of 1 0 mm etching to remove copper, as shown in the figure: high-frequency plate laying method
The burrs on the back of the gong board need to be carefully trimmed by hand to prevent damage to the substrate and copper surface, and then separate with sulfur free paper of considerable size and conduct visual inspection To reduce burrs, the key point is that the rolling process must have a good effect
Process flow NPTH's PTFE sheet processing flow
Cutting-Drilling-Dry Film-Inspection-Etching-Erosion Inspection-Solder Mask-Characters-Spray Tin-Forming-Testing-Final Inspection-Packaging-Shipment
PTH's PTFE plate processing flow
Cutting-drilling-hole treatment (plasma treatment or sodium naphthalene activation treatment)-copper immersion-board electricity-dry film-inspection-diagram electricity-etching-corrosion inspection-solder mask-character-spray tin-molding-test-final Inspection-Packaging-Shipping
Summarize the difficulties of PCB processing
1. Immersion copper: the hole wall is not easy to be copper
2. Line gap and trachoma control of map transmission, etc, line width
3. Green oil foaming control
4. Strictly control the scratches on the board surface in each process

The above is the explanation given by the editor of pcb circuit board company.
If you want to know more about PCBA, you can go to our company's home page to learn about it.
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