Definition of high frequency pcb manufacturing by circuit board high frequency board refers to special circuit board with high electromagnetIC frequency, PCB used in the field of high frequency (frequency greater than 300 MHz or wavelength less than 1 m) and microwave (frequency greater than 3 GHz or wavelength less than 0.1 m), and circuit board using common rigid circuit board manufacturing methods or adopting special processing methods on copper clad microwave substrate. Generally speaking, a high-frequency board can be defined as a board with a frequency above 1GHz!

With the rapid development of science and technology, more and more devices are used in the microwave frequency band (>1GHz) and even in the millimeter wave field (30GHz). This also means that the frequency is getting higher and higher, and the requirements for the substrate of the circuit board are getting higher and higher. For example, the substrate material needs to have excellent electrical properties and good chEMIcal stability. With the increase of power signal frequency, the loss on the substrate is required to be very SMAll, so the importance of high-frequency plates is highlighted. 2 Mobile communication products in the application field of PCB high frequency boards; Power amplifier, low noise amplifier, etc; Power divider, coupler, duplexer, filter and other passive components; High frequency electronic equipment is the development trend in automotive anti-collision system, satellite system, radio system and other fields.

Circuit board

High frequency board application field mobile communication products; Power amplifier, low noise amplifier, etc; Power divider, coupler, duplexer, filter and other passive components; High frequency electronic equipment is the development trend in automotive anti-collision system, satellite system, radio system and other fields.

Classification of high frequency boards Powder ceramic filLED thermosetting materials

A. Circuit board manufacturer:

4350B/4003C of Rogers

Arlon's 25N/25FR

Taconic TLG Series

B. Processing method of circuit board:

The processing process is SIMilar to that of epoxy resin/glass woven fabric (FR4), except that the plate is relatively brittle and easy to break. The life of the drill tip and the gong knife will be reduced by 20% when drilling holes and gongs. PTFE (polytetrafluoroethylene) material

A. Manufacturer: RO3000 series, RT series and TMM series of Rogers

Arlon's AD/AR series, IsoClad series, CuClad series

Taconic's RF series, TLX series, TLY series

F4B, F4BM, F4BK, TP-2 of Taixing Microwave

B. Processing method: 1. Cutting: the protective film must be kept to prevent scratches and indentation

2. Circuit board drilling

1. Use a new drill bit (standard 130), one piece for one stack is the best, and the pressure of the presser foot is 40psi

2. The aluminum sheet is the cover plate, and then use 1mm melamine backing plate to tighten the PTFE plate

3. Blow out the dust in the hole with air gun after drilling

4. With the most stable drilling rig, drilling parameters (basically, the smaller the hole, the faster the drilling speed, the smaller the chip load, the smaller the return speed)

3. Hole processing of circuit board

Plasma treatment or sodium naphthalene activation treatment is conducive to pore metallization

4. Circuit board PTH copper plating

1 After micro etching (the micro etching rate is controlled by 20 micro inches), pull at PTH to enter the plate from the oil cylinder

2. If necessary, after the second PTH, it is only necessary to start from the estimated? Cylinder starts to enter the plate

5. Soldering resistance of circuit board

1. Pretreatment: acid washing is used instead of mechanical grinding

2. Baked plate after pretreatment (90 ℃, 30min), painted with green oil for curing

Three sections of baking board: one section at 80 ℃, 100 ℃, 150 ℃, 30 min each (if the substrate surface is found to shed oil, it can be reworked: wash the green oil and reactivate it)

6. Circuit board gongs

Lay the white paper on the PTFE board line pavement, and clamp it up and down with FR-4 base material plate or phenolic base plate with 1.0mm thick etched copper removal, as shown in the figure: high-frequency plate, gongs and plates lamination method

The rough edges on the back edge of the gongs need to be carefully trimmed by hand to prevent damage to the base material and copper surface. They should be separated by sulfur free paper of appropriate size and visually inspected. Burrs should be reduced. The key point is that the gongs should be removed effectively during the process. four

Process flow NPTH's PTFE plate processing flow

Cutting - drilling - dry film - inspection - etching - corrosion inspection - solder resistance - characters - tin spraying - forming - testing - final inspection - packaging - shipping

Process flow of PTFE plate of PTH

Cutting - drilling - hole treatment (plasma treatment or sodium naphthalene activation treatment) - copper deposition - plate electricity - dry film - inspection - graphic electricity - etching - corrosion inspection - solder resistance - characters - tin spraying - forming - testing - final inspection - packaging - shipment

Circuit board design

Summarize the difficulties in processing high frequency boards of circuit boards

1. Copper sinking: the hole wall is not easy to be coated with copper

2. Control of line gap and sand hole of drawing, etching and line width

3. Green oil process: control of green oil adhesion and green oil foaming

4. Scratches on the board surface shall be strictly controlled in each process.