How can X-ray detection technology be better used in PCBA? Let's first understand the development of the industry. With the development of high-density packaging technology, it also brings new challenges to testing technology. In order to meet new challenges, many new technologies are emerging. X-ray detection technology is a very important way. X-ray inspection can effectively control and assemble quality. The current X-ray detection system is not only used for laboratory analysis, but has been specially used in many industries. PCBA industry is one of them. To some extent, X-ray inspection technology is a necessary means to ensure the quality of electronic assembly.

From the perspective of PCBA industry, BGA detection has been paid more and more attention. In order to ensure the quality of invisible solder joints in the PCBA assembly process of such devICes, X-ray detection is an indispensable important tool. This is because the X-ray inspection technology can penetrate the inside of the package and directly detect the quality of the solder joint. As the packaging mode of semiconductor product components is becoming SMAller, better X-ray is needed

Testing equipment to ensure the demand for miniaturization testing of product components.

x-ray inspection 

SEMIconductor X-ray testing equipment AX8500

X-ray produced by Nippon Technologies

The detection equipment is very suitable for the solder joint detection of IC components. Its X-ray detection has high definition X-ray images and analysis defects (such as:

Open circuit, short circuit, solder skips, etc.). Not only that, but also the X-ray produced by UFJ

The X-ray detector also has enough magnification to allow PCB manufacturers to easily see detaiLED product defects, so as to meet current and future needs.

PCB proofing quality assurance

PCB proofing

(1) P Inspection of negative film

All negative films shall be visually inspected after being developed.

The main inspection items include: broken thread, short, thin thread, alignment, and whether there is any injury on the negative film.

Protect with plastic bags after inspection.

(2) Inspection after exposure of PCB proofing inner layer (double sided boards do not need to be inspected)

After the inner layer of dry ink is exposed, conduct visual inspection.

The main inspection items include: wire breakage, short, foreign matter attachment, alignment, and damage.

(3) Inspection after etching of PCB proofing inner layer (double sided boards do not need to be inspected)

After the inner layer of dry ink is exposed, conduct visual inspection.

The main inspection items include: wire breakage, short, whether there is damage, discoloration, protrusion, foreign matter attachment, peeling, residual copper, and cutting.

(4) Inspection after PCB proofing and copper plating

Carry out visual inspection after copper plating.

The main inspection items are: whether the copper is broken and whether the hole is blocked.

(5) Inspection of PCB proofing outer layer after exposure

Carry out visual inspection after exposure of dry ink.

The main inspection items include: wire breakage, short, foreign matter attachment, alignment, and damage.

(6) Inspection of PCB proofing outer layer after etching

After etching, perform visual inspection.

The main inspection items include: wire breakage, short, whether there is damage, discoloration, protrusion, foreign matter attachment, peeling, residual copper, and cutting.

(7) PCB Proofing Delivery Inspection

After the PCB proofing board is made, visual inspection shall be carried out.

After inspection, package according to the material number.